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z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com specification kwt803-s ssc ssc ssc ssc customer customer customer customer drawn approval approval
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com contents 1. description 2. absolute maximum ratings 3. electro-optical characteristics 4. optical characteristics 5. reliability test 6. color & binning 7. bin code description 8. outline dimension 9. reel structure 10. packing 11. soldering 12. precaution for use 13. handling of silicone resin leds
z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com kwt803-s features applications 1. description this surface-mount led comes in plcc standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range 40 to 100 . ? white colored smt package ? ingan material ? suitable for all smt assembly and soldering methods ? pb-free reflow soldering application ? rohs compliant ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting ? white back-light
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 2. absolute maximum ratings [1] 3. electro-optical characteristics [note] all measurements were made under the standar dized environment of ssc. 125 t j junction temperature -40~+100 t stg storage temperature -40~+85 t opr operating temperature v 5 v r reverse voltage ma 90 i fm [2] peak forward current ma 30 i f forward current mw 111 p d power dissipation unit value symbol parameter oc/w 76 i f =20ma r th js thermal resistance [3] kv - - 1 1.5k ? ;100pf esd (hbm) - - 68 62 i f =20ma ra color rendering index* deg. - 115 - i f =20ma 2 1/2 viewing angle [2] k 8,900 - 5,300 i f =20ma cct color temperature mcd 2,500 - 1,700 i f =20ma i v luminous intensity* [1] a 10 - - v f =5v i r reverse current v 3.4 3.2 2.9 i f =20ma v f forward voltage* unit max. typ. min. condition symbol parameter [1] the luminous intensity iv was measured at the p eak of the spatial pattern which may not be aligne d with the mechanical axis of the led package. [2] 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: r th js (junction / solder) * tolerance : v f : 0.05v, i v : 10%, ra : 3, x,y : 0.01 [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the prod uct. [2] i fm was measured at tw 1 msec of pulse width and d 1/10 of duty ratio. [3] leds properties might be different from sugges ted values like above and below tables if operation condition will be exceeded our parameter range.
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com -90 -60 -30 90 60 30 0 ( t a =25 o c ) forward current vs. forward voltage relative luminous intensity vs forward current ( t a =25 o c ) 0 10 20 30 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 forward voltage v f (v) forward current i f [ma] relative luminous intensity [%] forward current i f [ma] radiation diagram forward current derating curve 4. optical characteristics -25 0 25 50 75 100 0 5 10 15 20 25 30 35 forward current i f [ma] ambient temperature ta( o c) 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 0 10 20 30 40 50 60 70 80 90
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 4. optical characteristics spectrum 300 400 500 600 700 800 0.0 0.5 1.0 relative emission intensity wavelength [nm]
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 5. reliability test - lsl *2 0.5 i f =20ma i v luminous intensity usl *1 1.2 - i f =20ma v f forward voltage max min criteria for judgement condition symbol item note : *1 usl : upper standard level *2 lsl : lower standard level ? ?? ? criteria for judging the damage criteria for judging the damage criteria for judging the damage criteria for judging the damage 0/22 3 time 1kv at 1.5k ? ; 100pf mil-std- 883d esd(hbm) 0/22 1000 hours t a =-40 o c, i f =20ma internal reference low temperature life test 0/22 500 hours t a =85 o c, i f =20ma internal reference high temperature life test 0/22 500 hours t a =60 o c, rh=90%, i f =20ma internal reference high temperature high humidity life test 0/22 1000 hours t a =25 o c, i f =20ma internal reference operating endurance test 0/22 1000 hours t a =-40 o c eiaj ed-4701 low temperature storage 0/22 1000 hours t a =60 o c, rh=90% eiaj ed-4701 high temp. high humidity storage 0/22 1000 hours t a =100 o c eiaj ed-4701 high temperature storage 0/22 100 cycle t a =-40 o c(30min) ~ 100 o c(30min) eiaj ed-4701 thermal shock number of damaged duration / cycle test conditions reference item
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515 520 525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620 630 830 cie y cie x
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.26 0.28 0.30 0.32 0.34 0.36 0.38 5300k 5600k 6000k 6500k 7000k 7800k 8900k g6 g5 g4 g3 g2 g1 f6 f5 f4 f3 f2 f1 e6 e5 e4 e3 e2 cie y cie x e1
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 0.3335 0.3273 0.3415 0.3237 0.3485 0.3205 0.3265 0.3305 0.3335 0.3273 0.3415 0.3237 0.3125 0.3225 0.3195 0.3193 0.3275 0.3157 0.3195 0.3193 0.3275 0.3157 0.3345 0.3125 cie y cie x cie y cie x cie y cie x f6 f5 f4 0.3195 0.3193 0.3275 0.3157 0.3345 0.3125 0.3125 0.3225 0.3195 0.3193 0.3275 0.3157 0.2985 0.3145 0.3055 0.3113 0.3135 0.3077 0.3055 0.3113 0.3135 0.3077 0.3205 0.3045 cie y cie x cie y cie x cie y cie x f3 f2 f1 0.3055 0.3113 0.3135 0.3077 0.3205 0.3045 0.2985 0.3145 0.3055 0.3113 0.3135 0.3077 0.2845 0.3065 0.2915 0.3033 0.2995 0.2997 0.2915 0.3033 0.2995 0.2997 0.3065 0.2965 cie y cie x cie y cie x cie y cie x e6 e5 e4 0.2915 0.3033 0.2995 0.2997 0.3065 0.2965 0.2845 0.3065 0.2915 0.3033 0.2995 0.2997 0.2705 0.2985 0.2775 0.2953 0.2855 0.2917 0.2775 0.2953 0.2855 0.2917 0.2925 0.2885 cie y cie x cie y cie x cie y cie x e3 e2 e1
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 0.3615 0.3433 0.3695 0.3397 0.3765 0.3365 0.3545 0.3465 0.3615 0.3433 0.3695 0.3397 0.3405 0.3385 0.3475 0.3353 0.3555 0.3317 0.3475 0.3353 0.3555 0.3317 0.3625 0.3285 cie y cie x cie y cie x cie y cie x g6 g5 g4 0.3475 0.3353 0.3555 0.3317 0.3625 0.3285 0.3405 0.3385 0.3475 0.3353 0.3555 0.3317 0.3265 0.3305 0.3335 0.3273 0.3415 0.3237 0.3335 0.3273 0.3415 0.3237 0.3485 0.3205 cie y cie x cie y cie x cie y cie x g3 g2 g1
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com bin code luminous intensity cie forward voltage k0 f1 z1 e ~ g color rank @ i f = 20ma 3.1 3.0 z1 3.0 2.9 y 3.2 3.1 z2 3.3 3.2 z3 3.4 3.3 a1 max. min. bin code forward voltage (v) @ i f = 20ma flux (lm) 6.8 6.5 6.2 5.9 5.7 5.4 5.2 4.9 typ 1,900 1,800 j8 2,500 2,400 k4 2,400 2,300 k3 2,300 2,200 k2 2,200 2,100 k1 2,100 2,000 k0 2,000 1,900 j9 1,800 1,700 j7 max. min. bin code luminous intensity (mcd) @ i f = 20ma 7. bin code description [note] all measurements were made under the standar dized environment of ssc. in order to ensure availability, single color rank will not be orderable. available ranks not yet available ranks
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 8. outline dimension ( tolerance: 0.2, unit: mm ) recommended solder pattern 9. reel structure ( tolerance: 0.2, unit: mm ) (1) quantity : 3000pcs/ reel (2) cumulative tolerance : cumulative tolerance/ 10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion stre ngth to be 0.1- 0.7n when the cover tape is turned o ff from the carrier tape at the angle of 10 o to the carrier tape (4) package : p/ n, manufacturing data code no. and quantity to be indicated on a damp proof package
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 1 side outer box structure material : paper(sw3b(b)) a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type 7inch size (mm) 220 245 245 220 a b 102 142 c acriche semiconductor ecolight rohs tuv made in korea 10. packing
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 11. soldering lead solder lead solder lead solder lead solder pre pre pre pre- -- -heat heat heat heat 120~150 120~150 120~150 120~150 pre pre pre pre- -- -heat time heat time heat time heat time 120 sec. max. 120 sec. max. 120 sec. max. 120 sec. max. peak peak peak peak- -- -temperature temperature temperature temperature 240 240 240 240 max. max. max. max. soldering time soldering time soldering time soldering time condition condition condition condition 10 sec. max. 10 sec. max. 10 sec. max. 10 sec. max. 10 sec. max. 10 sec. max. 10 sec. max. 10 sec. max. soldering time soldering time soldering time soldering time condition condition condition condition 260 260 260 260 max. max. max. max. peak peak peak peak- -- -temperature temperature temperature temperature 120 sec. 120 sec. 120 sec. 120 sec. max. max. max. max. pre pre pre pre- -- -heat time heat time heat time heat time 150~200 150~200 150~200 150~200 pre pre pre pre- -- -heat heat heat heat lead free solder lead free solder lead free solder lead free solder lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max. (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under sold ering iron. (4) the encapsulated material of the leds is silicon e. precautions should be taken to avoid the strong pre ssure on the encapsulated part. so when using the chip mounter, the picking up nozz le that does not affect the silicone resign should be used. (5) it is recommended that the customer use the nit rogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than t wo times. in the case of more than 24 hours passed soldering after first, leds will be damaged.
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 12. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. otherwise, to store th em in the following environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the ligh t intensity to drop. attention in followed; keeping of a fraction temperature : 5 ~ 40oc humidity : less than 10% (3) in the case of more than 4 week passed after op ening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 5oc. (4) silver plating might be tarnished in the enviro nment that contains corrosive gases and materials. also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties co mpare to normal ones. please do not expose the product in the corrosive e nvironment during the storage. (5) any mechanical force or any excess vibration sh all not be accepted to apply during cooling process to normal temperature after solderi ng. (6) quick cooling shall be avoided. (7) components shall not be mounted on warped direc tion of pcb. (8) anti radioactive ray design is not considered f or the products. (9) this device should not be used in any type of f luid such as water, oil, organic solvent etc. when washing is required, ipa should b e used. (10) when the leds are illuminating, operating curre nt should be decided after considering the ambient maximum temperature. (11) the leds must be soldered within seven days aft er opening the moisture-proof packing. (12) repack unused products with anti-moisture pack ing, fold to close any opening and then store in a dry place. (13) the appearance and specifications of the produ ct may be modified for improvement without notice.
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.08 rev.08 aug 2011 aug 2011 www.seoulsemicon.com www.seoulsemicon.com 13. handling of silicone resin leds (1) during processing, mechanical stress on the sur face should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surfac e can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, ex cept that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the hand ling of such devices. compared to standard encapsulants, silicone is generally softer , and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level o f dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be ap plied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleani ng. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led.

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